Our Technologies
Copper Pillar Bump
Molded Interconnect Subtrate (MIS)
No Flow Underfill & Flipchip Packaging
Technical Library

      With fundamental inventions to improve packaging techniques, APSI further developed its products and services into a full packaging solution. With the Flip Chip on Leadframe (FCOL) packaging and Flip Chip on Substrate (FCOS) packaging, and integrating with No-Flow Underfill bonding process, APSI addresses numerous IC packaging challenges to meet the ever-increasing technical demands and become a complete solution provider for IC packaging.

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